Homoleptic lanthanide deposition precursors

ABSTRACT

Described are lanthanide-containing metal coordination complexes which may be used as precursors in thin film depositions, e.g. atomic layer deposition processes. More specifically, described are homoleptic lanthanide-aminoalkoxide metal coordination complexes, lanthanide-carbohydrazide metal coordination complexes, and lanthanide-diazadiene metal coordination complexes. Additionally, methods for depositing lanthanide-containing films through an atomic layer deposition process are described.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. Provisional Application No.62/796,787, filed Jan. 25, 2019, the entire disclosure of which ishereby incorporated by reference herein.

TECHNICAL FIELD

Embodiments of the disclosure generally relate to deposition precursorsand methods for depositing thin films using said precursors. Moreparticularly, provided are homoleptic lanthanide precursor compounds andmethods for producing lanthanide containing films.

BACKGROUND

The semiconductor industry faces many challenges in the pursuit ofdevice miniaturization, which involves rapid scaling of nanoscalefeatures. Challenges include the introduction of complex fabricationsteps such as multiple lithography exposures and the integration of highperformance materials. To produce nanoscale features for next-generationsemiconductor devices, an available selection of materials havingdifferent etch selectivities need to be available so that precisepatterns and dimensions can be created.

When there is an array of different materials that are exposed during asingle etch step, one material may be etched faster than the others.Materials of high interest in the semiconductor industry are those thatattain high etch resistance towards common etch processes. Suchmaterials include yttrium and lanthanide-containing materials due totheir inherent chemical stability towards exposure of halide-basedetchants. Additionally, when these films are coated on semiconductorequipment (etchers, ALD/CVD reactors, implanters, etc.), they canincrease the lifetime of the tool, increase tool availability, anddecrease the risk for metal contamination from chamber corrosion.

There are very few processes available that demonstrate deposition ofyttrium and lanthanide-containing materials. There are a limited numberof viable chemical precursors available that have the requisiteproperties of robust thermal stability, high reactivity, and vaporpressure suitable for film growth to occur. In addition, precursors thatmay meet these requirements suffer from poor long-term stability andlead to thin films that contain elevated concentrations of contaminantssuch as carbon and/or halides, which are deleterious to the target filmapplication. Therefore, there is a need for new precursors containingyttrium and lanthanides.

SUMMARY

One or more embodiments of the disclosure are directed to a metalcoordination complex having a formula I: Ln_(x)L_(y) (I), wherein Ln isa lanthanide having an oxidation state of +3; x is 1 or 2; y is aninteger from 1 to 4; L is selected from NR′CH₂CR₂O, NR′N═CRO, orNR═CHCH═NR; and R, R′ are independently selected from hydrogen, branchedor unbranched C₁₋₁₂ alkyl, substituted or unsubstituted C₁₋₁₂ aryl,branched or unbranched C₁₋₆ alkenyl, branched or unbranched C₁₋₆alkynyl, acyl, alkyamido, hydrazido, silyl, aldehyde, or keto groups.

Additional embodiments of the disclosure are directed to methods ofdepositing a film. The method comprises: exposing a substrate to alanthanide-containing precursor to form a lanthanide species on thesubstrate, wherein the lanthanide-containing precursor comprises a metalcoordination complex of formula I Ln_(x)L_(y) (I), wherein Ln is alanthanide having an oxidation state of +3 and is selected from thegroup consisting of Y, Sc, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho,Er, Tm, Yb, and Lu; x is 1 or 2; y is an integer from 1 to 4; L isselected from NR′CH₂CR₂O, NR′N═CRO, or NR═CHCH═NR; and R, R′ areindependently selected from hydrogen, branched or unbranched C₁₋₁₂alkyl, substituted or unsubstituted C₁₋₁₂ aryl, branched or unbranchedC₁₋₆ alkenyl, branched or unbranched C_(i-6) alkynyl, acyl, alkyamido,hydrazido, silyl, aldehyde, or keto groups; and exposing the substrateto a reactant to react with the lanthanide species on the substrate toform a lanthanide film.

Further embodiments of the disclosure are directed to a method ofdepositing a film, the method comprising: positioning a substrate in aprocessing chamber; exposing at least a portion of a substrate surfaceto a lanthanide-containing precursor comprising a metal coordinationcomplex of formula I Ln_(x)L_(y) (I), wherein Ln is a lanthanide havingan oxidation state of +3 and is selected from the group consisting of Y,Sc, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; x is1 or 2; y is an integer from 1 to 4; L is selected from NR′CH₂CR₂O,NR′N═CRO, or NR═CHCH═NR; and R, R′ are independently selected fromhydrogen, branched or unbranched C₁₋₁₂ alkyl, substituted orunsubstituted C₁₋₁₂ aryl, branched or unbranched C₁₋₆ alkenyl, branchedor unbranched C₁₋₆ alkynyl, acyl, alkyamido, hydrazido, silyl, aldehyde,or keto groups; purging the processing chamber of thelanthanide-containing precursor; exposing at least a portion of thesubstrate surface to a reactant; and purging the processing chamber ofthe reactant to deposit a lanthanide-containing film on the substratesurface.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the presentdisclosure can be understood in detail, a more particular description ofthe disclosure, briefly summarized above, may be had by reference toembodiments, some of which are illustrated in the appended drawings. Itis to be noted, however, that the appended drawings illustrate onlytypical embodiments of this disclosure and are therefore not to beconsidered limiting of its scope, for the disclosure may admit to otherequally effective embodiments.

FIG. 1 shows a schematic view of a processing platform in accordancewith one or more embodiment of the disclosure;

FIG. 2 shows a cross-sectional view of a batch processing chamber inaccordance with one or more embodiment of the disclosure;

FIG. 3 shows a partial perspective view of a batch processing chamber inaccordance with one or more embodiment of the disclosure;

FIG. 4 shows a schematic view of a batch processing chamber inaccordance with one or more embodiment of the disclosure;

FIG. 5 shows a schematic view of a portion of a wedge shaped gasdistribution assembly for use in a batch processing chamber inaccordance with one or more embodiment of the disclosure; and

FIG. 6 shows a schematic view of a batch processing chamber inaccordance with one or more embodiment of the disclosure.

In the appended figures, similar components and/or features may have thesame reference label. Further, various components of the same type maybe distinguished by following the reference label by a dash and a secondlabel that distinguishes among the similar components. If only the firstreference label is used in the specification, the description isapplicable to any one of the similar components having the same firstreference label irrespective of the second reference label.

DETAILED DESCRIPTION

Before describing several exemplary embodiments of the disclosure, it isto be understood that the disclosure is not limited to the details ofconstruction or process steps set forth in the following description.The disclosure is capable of other embodiments and of being practiced orbeing carried out in various ways.

As used in this specification and the appended claims, the term“substrate” refers to a surface, or portion of a surface, upon which aprocess acts. It will also be understood by those skilled in the artthat reference to a substrate can refer to only a portion of thesubstrate, unless the context clearly indicates otherwise. Additionally,reference to depositing on a substrate can mean both a bare substrateand a substrate with one or more films or features deposited or formedthereon.

A “substrate” as used herein, refers to any substrate or materialsurface formed on a substrate upon which processing is performed. Forexample, a substrate surface on which processing can be performedinclude, but are not limited to, materials such as silicon, siliconoxide, strained silicon, silicon on insulator (SOI), carbon dopedsilicon oxides, silicon nitride, doped silicon, germanium, galliumarsenide, glass, sapphire, and any other materials such as metals, metalnitrides, metal alloys, and other conductive materials, depending on theapplication. Substrates include, without limitation, semiconductorwafers. Substrates may be exposed to a pretreatment process to polish,etch, reduce, oxidize, hydroxylate (or otherwise generate or grafttarget chemical moieties to impart chemical functionality), annealand/or bake the substrate surface. In addition to processing directly onthe surface of the substrate itself, in the present disclosure, any ofthe film processing steps disclosed may also be performed on anunderlayer formed on the substrate as disclosed in more detail below,and the term “substrate surface” is intended to include such underlayeras the context indicates. Thus for example, where a film/layer orpartial film/layer has been deposited onto a substrate surface, theexposed surface of the newly deposited film/layer becomes the substratesurface. What a given substrate surface comprises will depend on whatmaterials are to be deposited, as well as the particular chemistry used.

“Atomic layer deposition” or “cyclical deposition” as used herein refersto a process comprising the sequential exposure of two or more reactivecompounds to deposit a layer of material on a substrate surface. As usedin this specification and the appended claims, the terms “reactivecompound”, “reactive gas”, “reactive species”, “precursor”, “processgas” and the like are used interchangeably to mean a substance with aspecies capable of reacting with the substrate surface or material onthe substrate surface in a surface reaction (e.g., chemisorption,oxidation, reduction, cycloaddition). The substrate, or portion of thesubstrate, is exposed sequentially to the two or more reactive compoundswhich are introduced into a reaction zone of a processing chamber.

In a time-domain ALD process, exposure to each reactive compound isseparated by a time delay to allow each compound to adhere and/or reacton the substrate surface and then be purged from the processing chamber.The reactive gases are prevented from mixing by the purging of theprocessing chamber between subsequent exposures.

In a spatial ALD process, the reactive gases are flowed into differentprocessing regions within a processing chamber. The different processingregions are separated from adjacent processing regions so that thereactive gases do not mix. The substrate can be moved between theprocessing regions to separately expose the substrate to the processinggases. During substrate movement, different portions of the substratesurface, or material on the substrate surface, are exposed to the two ormore reactive compounds so that any given point on the substrate issubstantially not exposed to more than one reactive compoundsimultaneously. As will be understood by those skilled in the art, thereis a possibility that a small portion of the substrate may be exposed tomultiple reactive gases simultaneously due to diffusion of the gaseswithin the processing chamber, and that the simultaneous exposure isunintended, unless otherwise specified.

In one aspect of a time-domain ALD process, a first reactive gas (i.e.,a first precursor or compound A) is pulsed into the reaction zonefollowed by a first time delay.A second precursor or compound B ispulsed into the reaction zone followed by a second delay. During eachtime delay, a purge gas, such as argon, is introduced into theprocessing chamber to purge the reaction zone or otherwise remove anyresidual reactive compound or reaction products or by-products from thereaction zone. Alternatively, the purge gas may flow continuouslythroughout the deposition process so that only the purge gas flowsduring the time delay between pulses of reactive compounds. The reactivecompounds are alternatively pulsed until a predetermined film or filmthickness is formed on the substrate surface. In either scenario, theALD process of pulsing compound A, purge gas, compound B and purge gasis a cycle. A cycle can start with either compound A or compound B andcontinue the respective order of the cycle until achieving a film withthe predetermined thickness.

In one aspect of a spatial ALD process, a first reactive gas and secondreactive gas (e.g., hydrogen radicals) are delivered simultaneously tothe reaction zone but are separated by an inert gas curtain and/or avacuum curtain. The gas curtain can be combination of inert gas flowsinto the processing chamber and vacuum stream flows out of theprocessing chamber. The substrate is moved relative to the gas deliveryapparatus so that any given point on the substrate is exposed to thefirst reactive gas and the second reactive gas.

A “pulse” or “dose” as used herein refers to a quantity of a source gasthat is intermittently or non-continuously introduced into the processchamber. The quantity of a particular compound within each pulse mayvary over time, depending on the duration of the pulse. A particularprocess gas may include a single compound or a mixture/combination oftwo or more compounds.

The durations for each pulse/dose are variable and may be adjusted toaccommodate, for example, the volume capacity of the processing chamberas well as the capabilities of a vacuum system coupled thereto.Additionally, the dose time of a process gas may vary according to theflow rate of the process gas, the temperature of the process gas, thetype of control valve, the type of process chamber employed, as well asthe ability of the components of the process gas to adsorb onto thesubstrate surface. Dose times may also vary based upon the type of layerbeing formed and the geometry of the device being formed. A dose timeshould be long enough to provide a volume of compound sufficient toadsorb/chemisorb onto substantially the entire surface of the substrateand form a layer of a process gas component thereon.

One or more embodiments of the disclosure advantageously provide a newclass of precursors containing aminoalkoxide, carbohydrazide, anddiazadienyl ligand sets. The precursors of one or more embodimentsadvantageously possess long-term stability. The precursors of someembodiments advantageously lead to films that have low levels oncontaminants.

In one or more embodiments, the class of precursors are metalcoordination complexes having a formula (I):Ln_(x)L_(y)   (I)

Wherein Ln is a lanthanide having an oxidation state of +3; x is 1 or 2;y is an integer from 1 to 4; L is selected from NR′CH₂CR₂O, NR′N═CRO, orNR═CHCH═NR; and R, R′ are independently selected from hydrogen, branchedor unbranched C₁₋₁₂ alkyl, substituted or unsubstituted C₁₋₁₂ aryl,branched or unbranched C₁₋₆ alkenyl, branched or unbranched C₁₋₆alkynyl, acyl, alkyamido, hydrazido, silyl, aldehyde, or keto groups.

As used herein, the term “lanthanide” or “Ln” refers to a series offifteen metallic chemical elements with atomic numbers 57 through 71and, additionally, yttrium and scandium. More specifically, as usedherein, the term “lanthanide” or “Ln” includes the chemical elementsyttrium (Y), scandium (Sc), lanthanum (La), cerium (Ce), praseodymium(Pr), neodymium (Nd), promethium (Pm), samarium (Sm), europium (Eu),gadolinium (Gd), terbium (Tb), dysprosium (Dy), holmium (Ho), erbium(Er), thullium (Tm), ytterbium (Yb), and lutetium (Lu). The chemistry ofthe lanthanides is dominated by the +3 oxidation state. All of thelanthanide elements exhibit the oxidation state +3, and some of thelanthanide elements exhibit other oxidation states included +2 and +4.In one or more embodiments, the lanthanides describe herein have anoxidation state of +3.

In one or more embodiments, Ln is selected from the group consisting ofY, Sc, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu.In more specific embodiments, Ln is selected from the group consistingof Y or La.

The metal coordination complex of one or more embodiments is homoleptic.As used herein, the term “homoleptic” refers to a chemical compound,more particularly, a metal coordination complex, in which the ligandscoordinated to the metal are all identical.

In one or more embodiments, there may be more than one lanthanide metalpresent, such that, in Formula (I) Ln_(x)L_(y) (I), x is 2. In saidembodiments, the metal coordination complex is a dimer. In otherembodiments, the metal coordination complex comprises two differentmetals selected from the group consisting of Y, Sc, La, Ce, Pr, Nd, Pm,Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu.

In one or more embodiments, there is a single lanthanide metal present,such that, in Formula (I) Ln_(x)L_(y) (I), x is 1.

In one or more embodiments, there is more than one ligand, L present inthe metal coordination complex. In Formula (I) Ln_(x)L_(y) (I), y is aninteger from 1 to 4. Thus, in some embodiments, there is one ligand, L,present. In another embodiment, there are two ligands present. Infurther embodiments, there are three ligands present. In still furtherembodiments, there are four ligands present.

In one or more specific embodiments, there is a single lanthanide metalpresent and there are three ligands present, such that, in Formula (I)Ln_(x)L_(y)(I), x is 1 and y is 3.

The metal coordination complex of one or more embodiments has alanthanide aminoalkoxide structure of Formula II:

wherein Ln is selected from the group consisting of Y, Sc, La, Ce, Pr,Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu, and R, R′ areindependently selected from hydrogen, branched or unbranched C₁₋₁₂alkyl, substituted or unsubstituted C₁₋₁₂ aryl, branched or unbranchedC₁₋₆ alkenyl, branched or unbranched C₁₋₆ alkynyl, acyl, alkyamido,hydrazido, silyl, aldehyde, or keto groups.

In specific embodiments, the lanthanide, Ln, comprises Y, Sc, or La.

In one or more embodiments, the metal coordination complex has alanthanide carbohydrazide structure of Formula (III):

wherein Ln is selected from the group consisting of Y, Sc, La, Ce, Pr,Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu, and R, R′ areindependently selected from hydrogen, branched or unbranched C₁₋₁₂alkyl, substituted or unsubstituted C₁₋₁₂ aryl, branched or unbranchedC₁₋₆ alkenyl, branched or unbranched C₁₋₆ alkynyl, acyl, alkyamido,hydrazido, silyl, aldehyde, or keto groups.

In specific embodiments, the lanthanide, Ln, comprises Y, Sc, or La.

In further embodiments, the metal coordination complex has a lanthanidediazadiene structure of Formula (IV):

wherein Ln is selected from the group consisting of Y, Sc, La, Ce, Pr,Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu, and R, R′ areindependently selected from hydrogen, branched or unbranched C₁₋₁₂alkyl, substituted or unsubstituted C₁₋₁₂ aryl, branched or unbranchedC₁₋₆ alkenyl, branched or unbranched C₁₋₆ alkynyl, acyl, alkyamido,hydrazido, silyl, aldehyde, or keto groups.

In specific embodiments, the lanthanide, Ln, comprises Y, Sc, or La.

It will be recognized by one of skill in the art that the absolutestereochemistry of the metal coordination complexes in one of or moreembodiments may be different than that depicted.

In one or more embodiments, the diazadiene ligands in Formula (IV) canadopt several resonance forms when binding to a lanthanide as depictedin scheme (I).

Each of these resonance forms imparts a different electronic charge onthe lanthanide metal center when bonded together in a metal complex.Resonance form (A) containing two double bonds (the diene) is a neutral,nonionic ligand (DAD0). Resonance form (B) of scheme (I) contains aradical resonance structure and is a monoanionic ligand (DAD1).Resonance form (C) of scheme (I) containing a single double bond is adianionic ligand (DAD2). For each of these resonance forms, R₁ and R₄are independently selected from the group consisting of hydrogen,branched or unbranched C₁₋₁₂ alkyl, substituted or unsubstituted C₁₋₁₂aryl, branched or unbranched C₁₋₆ alkenyl, branched or unbranched C₁₋₆alkynyl, acyl, alkyamido, hydrazido, silyl, aldehyde, or keto groups,and each of R₂ and R₃ are independently selected from H.

Some embodiments of the disclosure advantageously provide methods forforming lanthanide-containing films with high etch selectivity and lowlevels of contaminants. Some embodiments of the disclosureadvantageously provide methods for depositing lanthanide-containingfilms on a substrate surface. In specific embodiments, the lanthanide,Ln, comprises Y, Sc, or La.

In one or more embodiments, a lanthanide-containing film is formed byexposing a substrate to a lanthanide-containing precursor to form alanthanide species on the substrate, and exposing the substrate to areactant to react with the lanthanide species on the substrate to form alanthanide film. In one or more embodiments, a lanthanide-containingfilm is formed by exposing a substrate to a lanthanide-containingprecursor to form a lanthanide species on the substrate wherein thelanthanide-containing precursor comprises a metal coordination complexof formula I Ln_(x)L_(y) (I) wherein Ln is a lanthanide having anoxidation state of +3, x is 1 or 2, y is an integer from 1 to 4, L isselected from NR′CH₂CRRO, NR′NCRO, or NR═CHCH═NR, and R, R′ areindependently selected from hydrogen, branched or unbranched C₁₋₁₂alkyl, substituted or unsubstituted C₁₋₁₂ aryl, branched or unbranchedC₁₋₆ alkenyl, branched or unbranched C₁₋₆ alkynyl, acyl, alkyamido,hydrazido, silyl, aldehyde, or keto groups; and exposing the substrateto a reactant to react with the lanthanide species on the substrate toform a lanthanide film. In one or more embodiments, the Ln is selectedfrom the group consisting of Y, Sc, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb,Dy, Ho, Er, Tm, Yb, and Lu. In other embodiments, the Ln is a lanthanidehaving an oxidation state of +3 and is selected from the groupconsisting of Y, Sc, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm,Yb, and Lu.

Some embodiments of the processing method provide that the metalcoordination complex has a structure of Formula (II), Formula (III), orFormula (IV):

wherein Ln is a lanthanide having an oxidation state of +3, x is 1 or 2,y is an integer from 1 to 4, L is selected from NR′CH₂CRRO, NR′NCRO, orNR═CHCH═NR, and R, R′ are independently selected from hydrogen, branchedor unbranched C₁₋₁₂ alkyl, substituted or unsubstituted C₁₋₁₂ aryl,branched or unbranched C₁₋₆ alkenyl, branched or unbranched C₁₋₆alkynyl, acyl, alkyamido, hydrazido, silyl, aldehyde, or keto groups. Inone or more embodiments, the Ln is selected from the group consisting ofY, Sc, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu.In other embodiments, the Ln is a lanthanide having an oxidation stateof +3 and is selected from the group consisting of Y, Sc, La, Ce, Pr,Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu.

In one or more embodiments, the substrate is exposed to a reactant toreact with the lanthanide species on the substrate to form a lanthanidefilm. The reactant of one or more embodiments comprises one or more ofO₂, O₃, H₂O₂, water, NH₃, hydrazine, hydrazine derivatives, NO₂, N₂O,silane, disilane, aminosilane, silylene, carbene, alkene, alkyne, boron,combinations thereof, or plasmas thereof.

In some embodiments, the lanthanide-containing precursor and thereactant are exposed to the substrate surface sequentially. In otherembodiments, the lanthanide-containing precursor and the reactant areexposed to the substrate surface simultaneously.

In some embodiments, the processing method further comprises exposingthe substrate to a metal-containing precursor to form a ternary materialcomprising Ln and one or more metal M selected from Sc, Ti, Lu, Co, Al,In, Y, La, Ac, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Tc, Fe, Ru, Os, Rh,Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, or Sn.

As used herein, the term “ternary material” refers to a compoundcontaining three different elements. In one or more embodiments, theternary material comprises a Ln, one or more metal M, and carbon,oxygen, nitrogen, boron, or silicon.

In one or more embodiments, the lanthanide film formed or depositedcomprises a lanthanide nitride film, a lanthanide oxide film, alanthanide carbide film, a lanthanide silicide film, a lanthanidesilicate film, a lanthanide boride film, a lanthanide carbonitride film,a lanthanide oxycarbide film, a lanthanide oxynitride film, a lanthanideboronitride film, a lanthanide metallic film, or combinations thereof.

In one or more embodiments, the ternary material formed or depositedcomprises a lanthanide metallic film. The lanthanide metallic film ofone or more embodiments comprises lanthanum scandate (LnScO₃), lanthanumtitanate (LnTiO₃), lanthanum lutetium oxide (LnLuO₃), lanthanum cobaltoxide (LnCoO₂), yttrium scandate (YScO₃), yttrium titanate (YTiO₃),yttrium lutetium oxide (YLuO₃), yttrium cobalt oxide (YCoO₂), orcombinations thereof. The skilled artisan will recognize that thechemical formulae shown are representative of an idealized film and arenot intended to impart stoichiometric limitations on the metallic filmcomposition. For example, a lanthanum scandate film will have lanthanum,scandium and oxygen atoms in approximately a 1:1:3 ratio.

In some embodiments, the lanthanide-containing precursor, the metal M,and the reactant are exposed to the substrate surface sequentially. Inother embodiments, the lanthanide-containing precursor, the metal M, andthe reactant are exposed to the substrate surface simultaneously.

In some embodiments, a two reactant (AB) process has a pulse sequenceincluding lanthanide-containing precursor exposure, purge, reactantexposure, purge to deposit the lanthanide-containing film. In atime-domain ALD process, the lanthanide-containing precursor can bepulsed to the processing chamber followed by purging out the excessreactant/by-products. The lanthanide-containing precursor adsorbs ontothe substrate (or reacts with the substrate surface) to leave alanthanide-containing species. The surface is exposed to a reactant(e.g., NH₃ or N₂) which reacts with surface chemisorbedlanthanide-containing-precursor. The reaction can be a thermal process(i.e., without plasma) or a plasma-enhanced process. Excess reactant,reaction products and/or by-products are purged from the processingchamber. In a spatial ALD process, the lanthanide-containing precursorand reactant are provided to different parts of the processing chamber.The process regions are separated by gas curtains which may includepurge gases and vacuum streams. The pulse sequence can be repeated togrow a film of a predetermined thickness.

Some embodiments provide a three reactant (ABC) process to form alanthanide containing film. PEALD of lanthanide containing film can beachieved by using the pulse sequence lanthanide-containing precursor,purge, reactant, purge, treatment plasma, purge. Those skilled in theart will understand that the pulse sequence can be used in a time-domainprocess or a spatial process. The lanthanide-containing precursor can bepulsed into the chamber followed by purging out the excessreactant/by-products, or moving the substrate out of thelanthanide-containing process region of a spatial ALD chamber. Thesubstrate can be exposed to a reactant (e.g., NH₃) in a thermal processto react with the lanthanide-containing species. Excess reactant can bepurged from the process chamber or the substrate can be moved from thereactant process region of the process chamber. The reactive sites onthe substrate can be regenerated by using a treatment plasma exposure.The pulse sequence can be repeated to grow a film of a predeterminedthickness.

In one or more embodiments, a method of depositing a film comprisespositioning a substrate in a processing chamber; exposing at least aportion of a substrate surface to a lanthanide-containing precursorcomprising a metal coordination complex of formula I Ln_(x)L_(y) (I)wherein Ln is a lanthanide having an oxidation state of +3 and isselected from the group consisting of Y, Sc, La, Ce, Pr, Nd, Pm, Sm, Eu,Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu, x is 1 or 2, y is an integer from 1to 4, L is selected from NR′CH₂CRRO, NR′NCRO, or NR═CHCH═NR, and R, R′are independently selected from hydrogen, branched or unbranched C₁₋₁₂alkyl, substituted or unsubstituted C₁₋₁₂ aryl, branched or unbranchedC₁₋₆ alkenyl, branched or unbranched C₁₋₆ alkynyl, acyl, alkyamido,hydrazido, silyl, aldehyde, or keto groups; purging the processingchamber of the lanthanide-containing precursor; exposing at least aportion of the substrate surface to a reactant; and purging theprocessing chamber of the reactant to deposit a lanthanide-containingfilm on the substrate surface.

In one or more embodiments, a nitrogen reactant is used. The nitrogenreactant can be any suitable nitrogen species that can react with thelanthanide-containing species on the substrate. In some embodiments, thenitrogen reactant comprises one or more of nitrogen, NO, NO₂, N₂O,ammonia, hydrazine or hydrazine derivatives. In some embodiments, thenitrogen reactant consists essentially of ammonia. As used in thisregard, the term “consists essentially of ammonia” means that thereactive species in the nitrogen reactant is greater than or equal toabout 95%, 98% or 99% of the stated species. In some embodiments, thenitrogen reactant is co-flowed with an inert, diluent or carrier gas.Suitable inert, diluent or carrier gases include, but are not limitedto, argon, hydrogen, helium and nitrogen. In some embodiments, thenitrogen reactant comprises, or consists essentially of, ammonia and thenitrogen reactant is mixed with one or more of N₂, Ar, H₂ or He.

In some embodiments, the nitrogen reactant comprises a reactant plasma.The reactant plasma of some embodiments comprises a plasma one or moreof nitrogen, ammonia, hydrazine or hydrazine derivatives. The reactantplasma may also include diluent or carrier gases, including but notlimited to nitrogen, argon, hydrogen, or helium and plasmas thereof. Thereactant plasma can be a direct plasma or remote plasma. The reactantplasma can be a conductively coupled plasma (CCP) or inductively coupledplasma (ICP).

The treatment plasma, as used herein, is a plasma exposure that isseparate from the nitrogen reactant. The deposition process can bethermal or plasma enhanced and the addition of a treatment plasma can beused with either. In some embodiments, the treatment plasma comprisesone or more of plasma activated Ar, N₂, H₂, He, or combination thereof.The treatment plasma can be a direct plasma or remote plasma. Thetreatment plasma can be a conductively coupled plasma (CCP) orinductively coupled plasma (ICP).

In some embodiments, the method includes exposing thelanthanide-containing film, on the substrate to a treatment plasma tochange a property of the film. In some embodiments, the treatment plasmacomprises one or more of nitrogen, argon, hydrogen or helium. Filmproperties which can be modified by the treatment plasma include, butare not limited to, density, wet etch rate and refractive index.

One or more embodiments of the disclosure are directed to a methodcomprising sequentially exposing a substrate to a lanthanide-containingprecursor and a first reactant to form a lanthanide-containing film, andsequentially exposing the substrate to a one or metal M selected fromSc, Ti, Lu, Co, Y, La, Al, I, Ac, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re,Tc, Fe, Ru, Os, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, or Sn, and asecond reactant to form a ternary lanthanide metallic film. The firstand second reactants can be the same or different. The concentrations,plasma states (i.e., no plasma or plasma) or chemical composition of thefirst reactant is independent of the second reactant. In someembodiments, the first reactant and the second reactant are the samespecies. In some embodiments, the first reactant and the second reactantare the same.

In some embodiments, the method also includes repeating the formation ofthe lanthanide-containing film to form a lanthanide-containing film of apredetermined thickness. The predetermined thickness of thelanthanide-containing film can vary depending on the use of the film.For example, a lanthanide-containing thin film may have a differentthickness than a lanthanide-containing etch contrast film which may havea different thickness than a lanthanide containing copper barrier layer.In some embodiments, the lanthanide-containing film has a thickness inthe range of about 1 Å to about 100 Å, or in the range of about 5 Å toabout 50 Å. In some embodiments, the lanthanide-containing film has athickness in the range of about 10 Å to about 1,000 Å, or in the rangeof about 100 Å to about 800 Å, or in the range of about 200 Å to about600 Å, or in the range of about 300 Å to about 500 Å.

In some embodiments, the lanthanide-containing precursor, optionally themetal M, and the reactant(s) are provided to the process chamber. Theprecursors and reactants can be provided as pure compounds, or may bediluted by a diluent or carrier gas. The reactive compound (includingany diluent or carrier gas) supplied to the chamber is referred to as aprocess gas.

Described below is an embodiment of a method of the disclosure wherein adeposited film is formed on the surface of a substrate using an atomiclayer deposition (ALD) process. The method described below is exemplaryand should not be construed as limiting. The methods of the disclosuremay contain additional process steps to those described below.

Each process gas may be supplied under different parameters than otherprocess gasses. A process gas may be provided in one or more pulses orcontinuously. The flow rate of a process gases can be any suitable flowrate including, but not limited to, flow rates is in the range of about1 to about 5000 sccm, or in the range of about 2 to about 4000 sccm, orin the range of about 3 to about 3000 sccm or in the range of about 5 toabout 2000 sccm. A process gas can be provided at any suitable pressureincluding, but not limited to, a pressure in the range of about 5 mTorrto about 25 Torr, or in the range of about 100 mTorr to about 20 Torr,or in the range of about 5 Torr to about 20 Torr, or in the range ofabout 50 mTorr to about 2000 mTorr, or in the range of about 100 mTorrto about 1000 mTorr, or in the range of about 200 mTorr to about 500mTorr.

The period of time that the substrate is exposed to a process gas may beany suitable amount of time necessary to allow the formation of anadequate nucleation layer or reaction atop the substrate surface. Forexample, a process gas may be flowed into the process chamber for aperiod of about 0.1 seconds to about 90 seconds. In some time-domain ALDprocesses, a process gas is exposed the substrate surface for a time inthe range of about 0.1 sec to about 90 sec, or in the range of about 0.5sec to about 60 sec, or in the range of about 1 sec to about 30 sec, orin the range of about 2 sec to about 25 sec, or in the range of about 3sec to about 20 sec, or in the range of about 4 sec to about 15 sec, orin the range of about 5 sec to about 10 sec.

In some embodiments, an inert gas may additionally be provided to theprocess chamber at the same time as a process gas. The inert gas may bemixed with a process gas (e.g., as a diluent gas) or separately and canbe pulsed or of a constant flow. In some embodiments, the inert gas isflowed into the processing chamber at a constant flow in the range ofabout 1 to about 10000 sccm. The inert gas may be any inert gas, forexample, such as argon, helium, neon, combinations thereof, or the like.

The temperature of the substrate during deposition can be controlled,for example, by setting the temperature of the substrate support orsusceptor. In some embodiments the substrate is held at a temperature inthe range of about 100° C. to about 600° C., or in the range of about200° C. to about 525° C., or in the range of about 300° C. to about 475°C., or in the range of about 350° C. to about 450° C. In one or moreembodiments, the substrate is maintained at a temperature less thanabout 475° C., or less than about 450° C., or less than about 425° C.,or less than about 400° C., or less than about 375° C.

In addition to the foregoing, additional process parameters may beregulated while exposing the substrate to a process gas. For example, insome embodiments, the process chamber may be maintained at a pressure ofabout 0.2 to about 100 Torr, or in the range of about 0.3 to about 90Torr, or in the range of about 0.5 to about 80 Torr, or in the range ofabout 1 to about 50 Torr.

After exposing the substrate to one process gas, the process chamber(especially in time-domain ALD) may be purged using an inert gas. (Thismay not be needed in spatial ALD processes as there is a gas curtainseparating the reactive gases.) The inert gas may be any inert gas, forexample, such as argon, helium, neon, or the like. In some embodiments,the inert gas may be the same, or alternatively, may be different fromthe inert gas provided to the process chamber during the exposure of thesubstrate to the first process gas. In embodiments where the inert gasis the same, the purge may be performed by diverting the first processgas from the process chamber, allowing the inert gas to flow through theprocess chamber, purging the process chamber of any excess first processgas components or reaction byproducts. In some embodiments, the inertgas may be provided at the same flow rate used in conjunction with thefirst process gas, described above, or in some embodiments, the flowrate may be increased or decreased. For example, in some embodiments,the inert gas may be provided to the process chamber at a flow rate ofgreater than 0 to about 10000 sccm to purge the process chamber. Inspatial ALD, purge gas curtains are maintained between the flows ofreactive gases and purging the process chamber may not be necessary. Insome embodiments of a spatial ALD process, the process chamber or regionof the process chamber may be purged with an inert gas.

The flow of inert gas may facilitate removing any excess process gasesand/or excess reaction byproducts from the process chamber to preventunwanted gas phase reactions. For example, the flow of inert gas mayremove excess process gas from the process chamber, preventing areaction between the lanthanide precursor and a subsequent process gas.

Then the substrate is exposed to a second process gas for a secondperiod of time. The second process gas may reacts with the species onthe substrate surface to create a deposited film. The second process gasmay be supplied to the substrate surface at a flow rate greater than thefirst process gas. In one or more embodiments, the flow rate is greaterthan about 1 time that of the first process gas, or about 100 times thatof the first process gas, or in the range of about 3000 to 5000 timesthat of the first process gas. The second process gas can be supplied,in time-domain ALD, for a time in the range of about 1 sec to about 30sec, or in the range of about 5 sec to about 20 sec, or in the range ofabout 10 sec to about 15 sec. The second process gas can be supplied ata pressure in the range of about 1 Torr to about 30 Torr, or in therange of about 5 Torr to about 25 Torr, or in the range of about 10 Torrto about 20 Torr, or up to about 50 Torr. The substrate temperature canbe maintained at any suitable temperature. In one or more embodiments,the substrate is maintained at a temperature less than about 475° C., orat a temperature about the same as that of the substrate during exposureto the first process gas.

The process chamber may again be purged using an inert gas. The inertgas may be any inert gas, for example, such as argon, helium, neon, orthe like. In some embodiments, the inert gas may be the same, oralternatively, may be different from the inert gas provided to theprocess chamber during previous process steps. In embodiments where theinert gas is the same, the purge may be performed by diverting thesecond process gas from the process chamber, allowing the inert gas toflow through the process chamber, purging the process chamber of anyexcess second process gas components or reaction byproducts. In someembodiments, the inert gas may be provided at the same flow rate used inconjunction with the second process gas, described above, or in someembodiments, the flow rate may be increased or decreased. For example,in some embodiments, the inert gas may be provided to the processchamber at a flow rate of greater than 0 to about 10,000 sccm to purgethe process chamber.

While the embodiment of the processing method described above includesonly two pulses of reactive gases, it will be understood that this ismerely exemplary and that additional pulses of process gases may beused. The pulses can be repeated in their entirety or in part. The cyclecan be repeated to form a film of a predetermined thickness.

Referring to the Figures, FIG. 1 shows a processing platform 100 inaccordance with one or more embodiment of the disclosure. The embodimentshown in FIG. 1 is merely representative of one possible configurationand should not be taken as limiting the scope of the disclosure. Forexample, in some embodiments, the processing platform 100 has differentnumbers of process chambers, buffer chambers and robot configurations.

The processing platform 100 includes a central transfer station 110which has a plurality of sides 111, 112, 113, 114, 115, 116. Thetransfer station 110 shown has a first side 111, a second side 112, athird side 113, a fourth side 114, a fifth side 115 and a sixth side116. Although six sides are shown, those skilled in the art willunderstand that there can be any suitable number of sides to thetransfer station 110 depending on, for example, the overallconfiguration of the processing platform 100.

The transfer station 110 has a robot 117 positioned therein. The robot117 can be any suitable robot capable of moving a wafer duringprocessing. In some embodiments, the robot 117 has a first arm 118 and asecond arm 119. The first arm 118 and second arm 119 can be movedindependently of the other arm. The first arm 118 and second arm 119 canmove in the x-y plane and/or along the z-axis. In some embodiments, therobot 117 includes a third arm or a fourth arm (not shown). Each of thearms can move independently of other arms.

A batch processing chamber 120 can be connected to a first side 111 ofthe central transfer station 110. The batch processing chamber 120 canbe configured to process x wafers at a time for a batch time. In someembodiments, the batch processing chamber 120 can be configured toprocess in the range of about four (x=4) to about 12 (x=12) wafers atthe same time. In some embodiments, the batch processing chamber 120 isconfigured to process six (x=6) wafers at the same time. As will beunderstood by the skilled artisan, while the batch processing chamber120 can process multiple wafers between loading/unloading of anindividual wafer, each wafer may be subjected to different processconditions at any given time. For example, a spatial atomic layerdeposition chamber, like that shown in FIGS. 2 through 6, expose thewafers to different process conditions in different processing regionsso that as a wafer is moved through each of the regions, the process iscompleted.

FIG. 2 shows a cross-section of a processing chamber 200 including a gasdistribution assembly 220, also referred to as injectors or an injectorassembly, and a susceptor assembly 240. The gas distribution assembly220 is any type of gas delivery device used in a processing chamber. Thegas distribution assembly 220 includes a front surface 221 which facesthe susceptor assembly 240. The front surface 221 can have any number orvariety of openings to deliver a flow of gases toward the susceptorassembly 240. The gas distribution assembly 220 also includes an outeredge 224 which in the embodiments shown, is substantially round.

The specific type of gas distribution assembly 220 used can varydepending on the particular process being used. Embodiments of thedisclosure can be used with any type of processing system where the gapbetween the susceptor and the gas distribution assembly is controlled.While various types of gas distribution assemblies can be employed(e.g., showerheads), embodiments of the disclosure may be particularlyuseful with spatial gas distribution assemblies which have a pluralityof substantially parallel gas channels. As used in this specificationand the appended claims, the term “substantially parallel” means thatthe elongate axis of the gas channels extend in the same generaldirection. There can be slight imperfections in the parallelism of thegas channels. In a binary reaction, the plurality of substantiallyparallel gas channels can include at least one first reactive gas Achannel, at least one second reactive gas B channel, at least one purgegas P channel and/or at least one vacuum V channel. The gases flowingfrom the first reactive gas A channel(s), the second reactive gas Bchannel(s) and the purge gas P channel(s) are directed toward the topsurface of the wafer. Some of the gas flow moves horizontally across thesurface of the wafer and out of the process region through the purge gasP channel(s). A substrate moving from one end of the gas distributionassembly to the other end will be exposed to each of the process gasesin turn, forming a layer on the substrate surface.

In some embodiments, the gas distribution assembly 220 is a rigidstationary body made of a single injector unit. In one or moreembodiments, the gas distribution assembly 220 is made up of a pluralityof individual sectors (e.g., injector units 222), as shown in FIG. 3.Either a single piece body or a multi-sector body can be used with thevarious embodiments of the disclosure described.

A susceptor assembly 240 is positioned beneath the gas distributionassembly 220. The susceptor assembly 240 includes a top surface 241 andat least one recess 242 in the top surface 241. The susceptor assembly240 also has a bottom surface 243 and an edge 244. The recess 242 can beany suitable shape and size depending on the shape and size of thesubstrates 60 being processed. In the embodiment shown in FIG. 2, therecess 242 has a flat bottom to support the bottom of the wafer;however, the bottom of the recess can vary. In some embodiments, therecess has step regions around the outer peripheral edge of the recesswhich are sized to support the outer peripheral edge of the wafer. Theamount of the outer peripheral edge of the wafer that is supported bythe steps can vary depending on, for example, the thickness of the waferand the presence of features already present on the back side of thewafer.

In some embodiments, as shown in FIG. 2, the recess 242 in the topsurface 241 of the susceptor assembly 240 is sized so that a substrate60 supported in the recess 242 has a top surface 61 substantiallycoplanar with the top surface 241 of the susceptor 240. As used in thisspecification and the appended claims, the term “substantially coplanar”means that the top surface of the wafer and the top surface of thesusceptor assembly are coplanar within ±0.2 mm. In some embodiments, thetop surfaces are coplanar within 0.5 mm, ±0.4 mm, ±0.35 mm, ±0.30 mm,±0.25 mm, ±0.20 mm, ±0.15 mm, ±0.10 mm or ±0.05 mm.

The susceptor assembly 240 of FIG. 2 includes a support post 260 whichis capable of lifting, lowering and rotating the susceptor assembly 240.The susceptor assembly may include a heater, or gas lines, or electricalcomponents within the center of the support post 260. The support post260 may be the primary means of increasing or decreasing the gap betweenthe susceptor assembly 240 and the gas distribution assembly 220, movingthe susceptor assembly 240 into proper position. The susceptor assembly240 may also include fine tuning actuators 262 which can makemicro-adjustments to susceptor assembly 240 to create a predeterminedgap 270 between the susceptor assembly 240 and the gas distributionassembly 220.

In some embodiments, the gap 270 distance is in the range of about 0.1mm to about 5.0 mm, or in the range of about 0.1 mm to about 3.0 mm, orin the range of about 0.1 mm to about 2.0 mm, or in the range of about0.2 mm to about 1.8 mm, or in the range of about 0.3 mm to about 1.7 mm,or in the range of about 0.4 mm to about 1.6 mm, or in the range ofabout 0.5 mm to about 1.5 mm, or in the range of about 0.6 mm to about1.4 mm, or in the range of about 0.7 mm to about 1.3 mm, or in the rangeof about 0.8 mm to about 1.2 mm, or in the range of about 0.9 mm toabout 1.1 mm, or about 1 mm.

The processing chamber 200 shown in the Figures is a carousel-typechamber in which the susceptor assembly 240 can hold a plurality ofsubstrates 60. As shown in FIG. 3, the gas distribution assembly 220 mayinclude a plurality of separate injector units 222, each injector unit222 being capable of depositing a film on the wafer, as the wafer ismoved beneath the injector unit. Two pie-shaped injector units 222 areshown positioned on approximately opposite sides of and above thesusceptor assembly 240. This number of injector units 222 is shown forillustrative purposes only. It will be understood that more or lessinjector units 222 can be included. In some embodiments, there are asufficient number of pie-shaped injector units 222 to form a shapeconforming to the shape of the susceptor assembly 240. In someembodiments, each of the individual pie-shaped injector units 222 may beindependently moved, removed and/or replaced without affecting any ofthe other injector units 222. For example, one segment may be raised topermit a robot to access the region between the susceptor assembly 240and gas distribution assembly 220 to load/unload substrates 60.

Processing chambers having multiple gas injectors can be used to processmultiple wafers simultaneously so that the wafers experience the sameprocess flow. For example, as shown in FIG. 4, the processing chamber200 has four gas injector assemblies and four substrates 60. At theoutset of processing, the substrates 60 can be positioned between thegas distribution assemblies 220. Rotating 17 the susceptor assembly 240by 45° will result in each substrate 60 which is between gasdistribution assemblies 220 to be moved to a gas distribution assembly220 for film deposition, as illustrated by the dotted circle under thegas distribution assemblies 220. An additional 45° rotation would movethe substrates 60 away from the gas distribution assemblies 220. Thenumber of substrates 60 and gas distribution assemblies 220 can be thesame or different. In some embodiments, there are the same numbers ofwafers being processed as there are gas distribution assemblies. In oneor more embodiments, the number of wafers being processed are fractionof or an integer multiple of the number of gas distribution assemblies.For example, if there are four gas distribution assemblies, there are 4×wafers being processed, where x is an integer value greater than orequal to one. In an exemplary embodiment, the gas distribution assembly220 includes eight process regions separated by gas curtains and thesusceptor assembly 240 can hold six wafers.

The processing chamber 200 shown in FIG. 4 is merely representative ofone possible configuration and should not be taken as limiting the scopeof the disclosure. Here, the processing chamber 200 includes a pluralityof gas distribution assemblies 220. In the embodiment shown, there arefour gas distribution assemblies 220 (also called injector assemblies)evenly spaced about the processing chamber 200. The processing chamber200 shown is octagonal; however, those skilled in the art willunderstand that this is one possible shape and should not be taken aslimiting the scope of the disclosure. The gas distribution assemblies220 shown are trapezoidal, but can be a single circular component ormade up of a plurality of pie-shaped segments, like that shown in FIG.3.

The embodiment shown in FIG. 4 includes a load lock chamber 280, or anauxiliary chamber like a buffer station. This chamber 280 is connectedto a side of the processing chamber 200 to allow, for example thesubstrates (also referred to as substrates 60) to be loaded/unloadedfrom the chamber 200. A wafer robot may be positioned in the chamber 280to move the substrate onto the susceptor.

Rotation of the carousel (e.g., the susceptor assembly 240) can becontinuous or intermittent (discontinuous). In continuous processing,the wafers are constantly rotating so that they are exposed to each ofthe injectors in turn. In discontinuous processing, the wafers can bemoved to the injector region and stopped, and then to the region 84between the injectors and stopped. For example, the carousel can rotateso that the wafers move from an inter-injector region across theinjector (or stop adjacent the injector) and on to the nextinter-injector region where the carousel can pause again. Pausingbetween the injectors may provide time for additional processing stepsbetween each layer deposition (e.g., exposure to plasma).

FIG. 5 shows a sector or portion of a gas distribution assembly 222,which may be referred to as an injector unit. The injector units 222 canbe used individually or in combination with other injector units. Forexample, as shown in FIG. 6, four of the injector units 222 of FIG. 5are combined to form a single gas distribution assembly 220. (The linesseparating the four injector units are not shown for clarity.) While theinjector unit 222 of FIG. 5 has both a first reactive gas port 225 and asecond gas port 235 in addition to purge gas ports 255 and vacuum ports245, an injector unit 222 does not need all of these components.

Referring to both FIGS. 5 and 6, a gas distribution assembly 220 inaccordance with one or more embodiment may comprise a plurality ofsectors (or injector units 222) with each sector being identical ordifferent. The gas distribution assembly 220 is positioned within theprocessing chamber and comprises a plurality of elongate gas ports 225,235, 245 in a front surface 221 of the gas distribution assembly 220.The plurality of elongate gas ports 225, 235, 245, 255 extend from anarea adjacent the inner peripheral edge 223 toward an area adjacent theouter peripheral edge 224 of the gas distribution assembly 220. Theplurality of gas ports shown include a first reactive gas port 225, asecond gas port 235, a vacuum port 245 which surrounds each of the firstreactive gas ports and the second reactive gas ports and a purge gasport 255.

With reference to the embodiments shown in FIG. 5 or 6, when statingthat the ports extend from at least about an inner peripheral region toat least about an outer peripheral region, however, the ports can extendmore than just radially from inner to outer regions. The ports canextend tangentially as vacuum port 245 surrounds reactive gas port 225and reactive gas port 235. In the embodiment shown in FIGS. 5 and 6, thewedge shaped reactive gas ports 225, 235 are surrounded on all edges,including adjacent the inner peripheral region and outer peripheralregion, by a vacuum port 245.

Referring to FIG. 5, as a substrate moves along path 227, each portionof the substrate surface is exposed to the various reactive gases. Tofollow the path 227, the substrate will be exposed to, or “see”, a purgegas port 255, a vacuum port 245, a first reactive gas port 225, a vacuumport 245, a purge gas port 255, a vacuum port 245, a second gas port 235and a vacuum port 245. Thus, at the end of the path 227 shown in FIG. 5,the substrate has been exposed to the first reactive gas 225 and thesecond reactive gas 235 to form a layer. The injector unit 222 shownmakes a quarter circle but could be larger or smaller. The gasdistribution assembly 220 shown in FIG. 6 can be considered acombination of four of the injector units 222 of FIG. 3 connected inseries.

The injector unit 222 of FIG. 5 shows a gas curtain 250 that separatesthe reactive gases. The term “gas curtain” is used to describe anycombination of gas flows or vacuum that separate reactive gases frommixing. The gas curtain 250 shown in FIG. 5 comprises the portion of thevacuum port 245 next to the first reactive gas port 225, the purge gasport 255 in the middle and a portion of the vacuum port 245 next to thesecond gas port 235. This combination of gas flow and vacuum can be usedto prevent or minimize gas phase reactions of the first reactive gas andthe second reactive gas.

Referring to FIG. 6, the combination of gas flows and vacuum from thegas distribution assembly 220 form a separation into a plurality ofprocess regions 350. The process regions are roughly defined around theindividual gas ports 225, 235 with the gas curtain 250 between 350. Theembodiment shown in FIG. 6 makes up eight separate process regions 350with eight separate gas curtains 250 between. A processing chamber canhave at least two process regions. In some embodiments, there are atleast three, four, five, six, seven, eight, nine, 10, 11 or 12 processregions.

During processing a substrate may be exposed to more than one processregion 350 at any given time. However, the portions that are exposed tothe different process regions will have a gas curtain separating thetwo. For example, if the leading edge of a substrate enters a processregion including the second gas port 235, a middle portion of thesubstrate will be under a gas curtain 250 and the trailing edge of thesubstrate will be in a process region including the first reactive gasport 225.

A factory interface 280 (as shown in FIG. 4), which can be, for example,a load lock chamber, is shown connected to the processing chamber 200. Asubstrate 60 is shown superimposed over the gas distribution assembly220 to provide a frame of reference. The substrate 60 may often sit on asusceptor assembly to be held near the front surface 221 of the gasdistribution plate 220. The substrate 60 is loaded via the factoryinterface 280 into the processing chamber 200 onto a substrate supportor susceptor assembly (see FIG. 4). The substrate 60 can be shownpositioned within a process region because the substrate is locatedadjacent the first reactive gas port 225 and between two gas curtains250 a, 250 b. Rotating the substrate 60 along path 227 will move thesubstrate counter-clockwise around the processing chamber 200. Thus, thesubstrate 60 will be exposed to the first process region 350 a throughthe eighth process region 350 h, including all process regions between.

Some embodiments of the disclosure are directed to a processing chamber200 with a plurality of process regions 350 a-350 h with each processregion separated from an adjacent region by a gas curtain 250. Forexample, the processing chamber shown in FIG. 6. The number of gascurtains and process regions within the processing chamber can be anysuitable number depending on the arrangement of gas flows. Theembodiment shown in FIG. 6 has eight gas curtains 250 and eight processregions 350 a-350 h.

Referring back to FIG. 1, the processing platform 100 includes atreatment chamber 140 connected to a second side 112 of the centraltransfer station 110. The treatment chamber 140 of some embodiments isconfigured to expose the wafers to a process to treat the wafers beforeand/or after processing in first batch processing chamber 120. Thetreatment chamber 140 of some embodiments comprises an annealingchamber. The annealing chamber can be a furnace annealing chamber or arapid thermal annealing chamber, or a different chamber configured tohold a wafer at a predetermined temperature and pressure and provide aflow of gas to the chamber.

In some embodiments, the processing platform further comprises a secondbatch processing chamber 130 connected to a third side 113 of thecentral transfer station 110. The second batch processing chamber 130can be configured similarly to the batch processing chamber 120, or canbe configured to perform a different process or to process differentnumbers of substrates.

The second batch processing chamber 130 can be the same as the firstbatch processing chamber 120 or different. In some embodiments, thefirst batch processing chamber 120 and the second batch processingchamber 130 are configured to perform the same process with the samenumber of wafers in the same batch time so that x (the number of wafersin the first batch processing chamber 120) and y (the number of wafersin the second batch processing chamber 130) are the same and the firstbatch time and second batch time (of the second batch processing chamber130) are the same. In some embodiments, the first batch processingchamber 120 and the second batch processing chamber 130 are configuredto have one or more of different numbers of wafers (x not equal to y),different batch times, or both.

In the embodiment shown in FIG. 1, the processing platform 100 includesa second treatment chamber 150 connected to a fourth side 114 of thecentral transfer station 110. The second treatment chamber 150 can bethe same as the treatment chamber 140 or different.

The processing platform 100 can include a controller 195 connected tothe robot 117 (the connection is not shown). The controller 195 can beconfigured to move wafers between the pre-clean chamber 140 and thefirst batch processing chamber 120 with a first arm 118 of the robot117. In some embodiments, the controller 195 is also configured to movewafers between the second single wafer processing chamber 150 and thesecond batch processing chamber 130 with a second arm 119 of the robot117.

In some embodiments, the controller 195 is connected to the susceptorassembly 240 and the gas distribution assembly 220 of a processingchamber 200. The controller 195 can be configured to rotate 17 thesusceptor assembly 240 about a central axis. The controller can also beconfigured to control the gas flows in the gas ports 225, 235, 245, 255.In some embodiments, the first reactive gas port 225 provides a flow ofa yttrium precursor. In some embodiments, the second reactive gas port235 provides a flow of a silicon precursor. In some embodiments, othergas ports (not labelled) may provide a flow of nitrogen reactant or atreatment plasma. The first reactive gas port 225, the second reactivegas port 235 and the other reactive gas ports (not labelled) may bearranged in any processing order.

The processing platform 100 can also include a first buffer station 151connected to a fifth side 115 of the central transfer station 110 and/ora second buffer station 152 connected to a sixth side 116 of the centraltransfer station 110. The first buffer station 151 and second bufferstation 152 can perform the same or different functions. For example,the buffer stations may hold a cassette of wafers which are processedand returned to the original cassette, or the first buffer station 151may hold unprocessed wafers which are moved to the second buffer station152 after processing. In some embodiments, one or more of the bufferstations are configured to pre-treat, pre-heat or clean the wafersbefore and/or after processing.

In some embodiments, the controller 195 is configured to move wafersbetween the first buffer station 151 and one or more of the treatmentchamber 140 and the first batch processing chamber 120 using the firstarm 118 of the robot 117. In some embodiments, the controller 195 isconfigured to move wafers between the second buffer station 152 and oneor more of the second treatment chamber 150 or the second batchprocessing chamber 130 using the second arm 119 of the robot 117.

The processing platform 100 may also include one or more slit valves 160between the central transfer station 110 and any of the processingchambers. In the embodiment shown, there is a slit valve 160 betweeneach of the processing chambers 120, 130, 140, 150 and the centraltransfer station 110. The slit valves 160 can open and close to isolatethe environment within the processing chamber from the environmentwithin the central transfer station 110. For example, if the processingchamber will generate plasma during processing, it may be helpful toclose the slit valve for that processing chamber to prevent stray plasmafrom damaging the robot in the transfer station.

In some embodiments, the processing chambers are not readily removablefrom the central transfer station 110. To allow maintenance to beperformed on any of the processing chambers, each of the processingchambers may further include a plurality of access doors 170 on sides ofthe processing chambers. The access doors 170 allow manual access to theprocessing chamber without removing the processing chamber from thecentral transfer station 110. In the embodiment shown, each side of eachof the processing chamber, except the side connected to the transferstation, have an access door 170. The inclusion of so many access doors170 can complicate the construction of the processing chambers employedbecause the hardware within the chambers would need to be configured tobe accessible through the doors.

The processing platform of some embodiments includes a water box 180connected to the transfer chamber 110. The water box 180 can beconfigured to provide a coolant to any or all of the processingchambers. Although referred to as a “water” box, those skilled in theart will understand that any coolant can be used.

In some embodiments, the size of the processing platform 100 allows forthe connection to house power through a single power connector 190. Thesingle power connector 190 attaches to the processing platform 100 toprovide power to each of the processing chambers and the centraltransfer station 110.

The processing platform 100 can be connected to a factory interface 102to allow wafers or cassettes of wafers to be loaded into the platform100. A robot 103 within the factory interface 102 can be moved thewafers or cassettes into and out of the buffer stations 151, 152. Thewafers or cassettes can be moved within the platform 100 by the robot117 in the central transfer station 110. In some embodiments, thefactory interface 102 is a transfer station of another cluster tool.

In some embodiments, the processing platform 100 or batch processingchamber 120 is connected to a controller. The controller can be the samecontroller 195 or a different controller. The controller can be coupledto the susceptor assembly and the gas distribution assembly of the batchprocessing chamber 120 and has one or more configurations. Theconfigurations can include, but are not limited to, a firstconfiguration to rotate the susceptor assembly about the central axis, asecond configuration to provide a flow of a lanthanide-containingprecursor to a process region, the lanthanide-containing precursorcomprising a lanthanide-containing species with a general formulaLn_(x)L_(y), wherein Ln is a lanthanide having an oxidation state of +3,x is 1 or 2, y is an integer from 1 to 4, L is selected from NR′CH₂CR₂O,NR′N═CRO, or NR═CHCH═NR and R, R′ are independently selected fromhydrogen, branched or unbranched C₁₋₁₂ alkyl, substituted orunsubstituted C₁₋₁₂ aryl, branched or unbranched C₁₋₆ alkenyl, branchedor unbranched C₁₋₆ alkynyl, acyl, alkyamido, hydrazido, silyl, aldehyde,or keto groups; a third configuration to provide a flow of one or moremetal M selected from Sc, Ti, Lu, Co, Y, La, Al, I, Ac, Zr, Hf, V, Nb,Ta, Cr, Mo, W, Mn, Re, Tc, Fe, Ru, Os, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au,Zn, Cd, or Sn to a process region; a fourth configuration to provide aflow of a reactant to one or more of the process regions, the nitrogenreactant comprising one or more of one or more of O₂, O₃, H₂O₂, water,NH₃, hydrazine, hydrazine derivatives, NO₂, N₂O, silane, disilane,alkene, alkyne, boron, combinations thereof, or plasmas thereof; or afifth configuration to provide a treatment plasma in a process region.

EXAMPLES Example 1—Aminoalkoxide Ligand Synthesis

A solution of 2-methyl-1-propenoxide dissolved in THF is slowly added toa stirred and pre-cooled solution of LiNMe₂ in THF. This mixture isstirred overnight at room temperature then quenched with a stoichometricamount of water. The resultant THF layer is dried over MgSO₄ and theproduct is obtained by fractional distillation.

Example 2—Lanthanide-Containing Aminoalkoxide Precursor Synthesis

To a cooled THF solution of the desired aminoalkoxide, an equivalentamount of MeLi is added. This solution is then added dropwise by cannulaover a 30 min period to a stirred suspension of any anhydrouslanthanide(III) chloride. The resultant solution is to be stirred for 6hours at ambient temperature. Solvent can then be removed in vacuo withthe resultant residue subjected to further purification(solid-sublimation, liquid-distillation).

Example 3—Thin Film Deposition

In a thin film deposition reactor with substrate temperatures are heldbetween 25 and 500° C., the selected lanthanide-containing precursor(held between 0-250° C.) is delivered to a substrate via vapor phasedelivery for a pre-determined pulse length (0.1-60 s). During thisprocess, the deposition reactor is operated under a flow of inertcarrier gas with the chamber held at a pre-determined temperature(0-500° C.) and pressure (selected between 1 mTorr-760 Torr). After thepulse of the selected lanthanide-containing precursor, the chamber isthen subsequently pumped and purged of all requisite gases andbyproducts for a determined amount of time. Subsequently, a co-reactantis pulsed into the chamber for a predetermined pulse length (0.1-60 s)and chamber pressure (1 mTorr-760 Torr). An additional chamber purge isthen performed to rid the reactor of any excess reactants and reactionbyproducts. This process is repeated as many times as necessary to getthe target film to the desired film thickness.

Reference throughout this specification to “one embodiment,” “certainembodiments,” “one or more embodiments” or “an embodiment” means that aparticular feature, structure, material, or characteristic described inconnection with the embodiment is included in at least one embodiment ofthe disclosure. Thus, the appearances of the phrases such as “in one ormore embodiments,” “in certain embodiments,” “in one embodiment” or “inan embodiment” in various places throughout this specification are notnecessarily referring to the same embodiment of the disclosure.Furthermore, the particular features, structures, materials, orcharacteristics may be combined in any suitable manner in one or moreembodiments.

Although the disclosure herein has been described with reference toparticular embodiments, it is to be understood that these embodimentsare merely illustrative of the principles and applications of thepresent disclosure. It will be apparent to those skilled in the art thatvarious modifications and variations can be made to the method andapparatus of the present disclosure without departing from the spiritand scope of the disclosure. Thus, it is intended that the presentdisclosure include modifications and variations that are within thescope of the appended claims and their equivalents.

What is claimed is:
 1. A metal coordination complex having a structureof Formula (II)

wherein Ln is selected from the group consisting of Y, Sc, La, Ce, Pr,Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu, and R, R′ areindependently selected from hydrogen, branched C₁₋₁₂ alkyl, unbrancehdC₁₋₁₂ alkyl, substituted C₁₋₁₂ aryl, un substituted C₁₋₁₂ aryl, branchedC₁₋₆ alkenyl, unbranched C₁₋₆ alkenyl, branched C₁₋₆ alkynyl unbranchedC₁₋₆ alkynyl, acyl, alkyamido, hydrazido, silyl, aldehyde, and ketogroups.
 2. The metal coordination complex of claim 1, wherein Ln is Y,Sc, or La.
 3. The metal coordination complex of claim 1, having astructure of Formula (III)

wherein Ln is selected from the group consisting of Y, Sc, La, Ce, Pr,Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu, and R, R′ areindependently selected from hydrogen, branched C₁₋₁₂ alkyl, unbranchedC₁₋₁₂ alkyl, substituted C₁₋₁₂ ary, unsubstituted C₁₋₁₂ aryl, branchedC₁₋₆ alkenyl, unbranched C₁₋₆ alkenyl, branched C₁₋₆ alkynyl, unbranchedC₁₋₆ alkynyl, acyl, alkyamido, hydrazido, silyl, aldehyde, and ketogroups.
 4. The metal coordination complex of claim 3, wherein Ln is Y,Sc, or La.
 5. A method of depositing a film, the method comprising:exposing a substrate to a lanthanide-containing precursor to form alanthanide species on the substrate, wherein the lanthanide-containingprecursor comprises the metal coordination complex of claim 1; andexposing the substrate to a reactant to react with the lanthanidespecies on the substrate to form a lanthanide film.
 6. The method ofclaim 5, further comprising exposing the substrate to a metal-containingprecursor to form a ternary material comprising Ln and one or more metalM selected from the group consisting of Sc, Ti, Lu, Co, Y, La, Al, I,Ac, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Tc, Fe, Ru, Os, Rh, Jr, Ni,Pd, Pt, Cu, Ag, Au, Zn, Cd, and Sn.
 7. The method of claim 6, whereinthe lanthanide film comprises a lanthanide nitride film, a lanthanideoxide film, a lanthanide carbide film, a lanthanide silicide film, alanthanide silicate film, a lanthanide boride film, a lanthanidecarbonitride film, a lanthanide oxycarbide film, a lanthanide oxynitridefilm, a lanthanide boronitride film, a lanthanide metallic film, orcombinations thereof.
 8. The method of claim 5, wherein the reactantcomprises one or more of O₂, O₃, H₂O₂, water, NH₃, hydrazine, hydrazinederivatives, NO₂, N₂O, silane, disilane, alkene, alkyne, boron,combinations thereof, or plasmas thereof.
 9. The method of claim 5,wherein the lanthanide-containing precursor and the reactant are exposedto the substrate sequentially.
 10. The method of claim 5, wherein thelanthanide-containing precursor and the reactant are exposed to thesubstrate simultaneously.
 11. A method of depositing a film, the methodcomprising: exposing a substrate to a lanthanide-containing precursor toform a lanthanide species on the substrate, wherein thelanthanide-containing precursor comprises the metal coordination complexof claim 3; and exposing the substrate to a reactant to react with thelanthanide species on the substrate to form a lanthanide film.
 12. Themethod of claim 11, further comprising exposing the substrate to ametal-containing precursor to form a ternary material comprising Ln andone or more metal M selected from the group consisting of Sc, Ti, Lu,Co, Y, La, Al, I, Ac, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Tc, Fe, Ru,Os, Rh, Jr, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, and Sn.
 13. The method ofclaim 12, wherein the lanthanide film comprises a lanthanide nitridefilm, a lanthanide oxide film, a lanthanide carbide film, a lanthanidesilicide film, a lanthanide silicate film, a lanthanide boride film, alanthanide carbonitride film, a lanthanide oxycarbide film, a lanthanideoxynitride film, a lanthanide boronitride film, a lanthanide metallicfilm, or combinations thereof.
 14. The method of claim 11, wherein thereactant comprises one or more of O₂, O₃, H₂O₂, water, NH₃, hydrazine,hydrazine derivatives, NO₂, N₂O, silane, disilane, alkene, alkyne,boron, combinations thereof, or plasmas thereof.
 15. The method of claim11, wherein the lanthanide-containing precursor and the reactant areexposed to the substrate sequentially.
 16. The method of claim 11,wherein the lanthanide-containing precursor and the reactant are exposedto the substrate simultaneously.